Ceramic thermal bridges
Reducing size and power without sacrificing efficiency and reliability By Daniel West, Lead Technical Applications Engineer at KYOCERA AVX. As active and passive electronic component manufacturers strive to reduce sizes…
Reducing size and power without sacrificing efficiency and reliability By Daniel West, Lead Technical Applications Engineer at KYOCERA AVX. As active and passive electronic component manufacturers strive to reduce sizes…
SemiQ, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high- voltage applications, has begun a known-good-die (KGD) screening program that delivers high-quality, electrically…
Inverter control modules and reference designs accelerate time- to-market by Mike Sandyck, Managing Director at CISSOID The push to electrify mobility requires power system designers to overcome the numerous challenges associated…
Wide-bandgap devices such as SiC are essential to modern applications. Technology is accelerating rapidly with different drivers across a multitude of application sectors. Looking at two of the most important…
Toshiba has launched five 1200V silicon-carbide (SiC) MOSFETs that leverage the company’s third generation SiC technology to boost the energy efficiency of high-voltage industrial applications. These devices are used in…
SEMIKRON, headquartered in Nuremberg, and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.…
The only simulator in the industry to enable web-based electrically and thermally coupled analysis. ROHM Semiconductor has announced the addition of a new thermal analysis function to the ROHM Solution…