xMEMS Labs has announced its latest industry- changing innovation: the xMEMS XMC-2400 μCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.
For the first time, with active, fan-based micro-cooling (μCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, andother advanced mobile devices with the silent, vibration-free, solid-state xMEMS XMC-2400 μCooling chip, which measures just 1-millimeter thin.
The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.